Abstract: This paper presents a robust inspection framework for detecting non-wet defects in semiconductor solder joints using 3D CT slice imaging and supervised learning. The proposed method ...
Pioneering instance management, driving innovative solutions for efficient resource utilization, and enabling a more sus ...
Abstract: Autonomous ground robot navigation in unstructured, mapless, and uneven terrains remains a challenging task due to variable slopes, environmental occlusions, and the need to preserve robot ...
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