Abstract: Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a ...

Abstract: Recent developments in photonics applications, in the fields of datacom, high-performance computing, and integrated optical sensors, have accelerated the trend toward electronic/optical ...

Instructor Aileen Abitong conducted computer class Wednesday with her students at Kulia Academy, the first school in the ...

Sixty-six trainees were awarded certificates under the digital literacy programme in Koderma as part of the state government’s ongoing efforts to promote skill development among youth.