Abstract: To minimize the effect by asymmetry of package, a novel chip-level thermal management method is proposed in this article, whereby the heat generated by the central heating resistor is ...
Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
As Hoosiers ring in 2026, three major initiatives have been announced for the new year, two related to the SNAP program and one addressing disparities in rural health. Hoosiers who use Supplemental ...
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