Abstract: The utilization of an Electromagnetic Vector Sensor (EMVS) array presents valuable insights in wireless communications and radars by incorporating the advantages of spatial, temporal, and ...

Abstract: In this article, a generalized phased array method is proposed, which enables a 1D linear array to perform 2D beam scanning capability. Generally, the linear array is capable of achieving ...

Here are five 2D platformers everyone forgot. 5) Prinny: Can I Really Be the Hero? Developer Nippon Ichi’s platformer is a comedic take on the genre, but don’t let that fool you. It’s devilishly ...

The global integrated circuit (IC) industry is confronting the physical limitations of Moore's Law. Atomic-layer-thick two-dimensional (2D) semiconductors, such as Molybdenum Disulfide (MoS2), are ...

A team of engineers at North Carolina State University has designed a polymer “Chinese lantern” that can rapidly snap into multiple stable 3D shapes—including a lantern, a spinning top, and more—by ...

SAXONBURG, Pa., Sept. 25, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a breakthrough in short-reach optical interconnect technology with the ...

Problem: Equation: ∂T∂t=α(∂2T∂x2+∂2T∂y2) Domain: 1x1 plate, hotspot at center BCs: Fixed edges, insulated edges Goal: Predict T(x,y,t)T(x,y,t)T(x,y,t) continuously Training: 2000 epochs, loss ...

OZ Optics Limited, a recognized leader in high-performance optical fiber components and subsystem module assemblies, is excited to announce the launch of its new line of 2D-Fiber Array (FA) assemblies ...

Memristors can be fabricated on a large scale and with high throughput by assembling 2D nanosheets from the dispersion into a resistive switching layer using solution processing techniques. As the ...

Researchers use circularly polarized light to control the direction of exciton polaritons in 2D semiconductors, enabling new tools for nanoscale photonics. (Nanowerk Spotlight) Directing light along ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.