In support of human resource development in Member States the IAEA has established education and training programmes on active learning about nuclear technologies using the PC-based basic principle ...
Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3D finite ...
Abstract: In the process of vacuum arc breaking, the axial magnetic field generated by the axial magnetic contact promotes the arc diffusion, and the initial arcing condition has an important ...
A playground for experimenting with PID, model‑predictive, and machine‑learning–based controllers. DeepPID provides both traditional and neural adaptive controllers in a single, consistent framework, ...
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