Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin ...

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

In a major boost to India’s semiconductor ambitions, Odisha is set to witness the arrival of one of the world’s most advanced chip packaging technologies, with the groundbreaking of the Heterogeneous ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more ...

India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

With two out of ten approved semiconductor projects nationwide located in the state, Odisha is positioning itself as a ...

The foundation stone for India’s first advanced 3D chip packaging unit was laid at Info Valley in the Khordha district in ...

Bhubaneswar: Odisha Chief Minister Mohan Charan Majhi and Union minister Ashwini Vaishnaw Sunday performed the groundbreaking ...