Automatic test-pattern generation (ATPG) has played a key role in semiconductor logic test, but several trends driving the need for semiconductor test quality are challenging traditional ATPG tools.

Multi-die design using 2.5D and 3D technologies has emerged as a necessity to keep the pace of innovation. For all their benefits, these projects present new challenges. This post considers monitoring ...

Integrates three separate applications into one unified platform to accelerate development cycles and speed time to market Eliminates the need for complex workflows ...

Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis ...

Embedded systems engineers face significant challenges in adding intelligence to myriad real-world applications. To succeed, they must select the proper tools to get their products to market quickly.

Artificial Intelligence (AI) is permeating and adding value at every junction of life and commerce. Semiconductors are a vital piece of the AI value chain, accelerating ML workloads, including ...

Internet of Things (IoT) security, one of the biggest challenges for embedded developers, is making way for physical unclonable functions (PUFs) into microcontroller (MCU) and system-on-chip (SoC) ...

Test engineers undoubtedly agree on the need for a test rig that can evaluate the reliability of a vehicle’s suspension system. However, developing and building a high-performance fatigue bench that ...

Offers doctors an intuitive way to design for in-practice 3D printing of models, bite splints, and restorations, leveraging the power of exocad CAD/CAM software with simplified doctor and ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. Cory Benfield discusses the evolution of ...