SAN FRANCISCO — Promising improved integration of thermal and electromagnetic compatibility (EMC) simulation, Flomerics Thursday (Aug. 11) released the latest version of its integrated analysis ...

Addressing EMC late in the design cycle is becoming less and less tenable as product complexity and densities increase and design cycles continue to shrink. The rules of thumb you commonly use to ...

Requirements for thermal and electromagnetic compatibility often butt heads. Here's how to reconciles the differences. Cooling analysis for electronic enclosures is well accepted. It's used by most ...

Two themes were evident at the 2014 EMC Symposium held in Raleigh, NC. Consolidation continues, with AMETEK acquiring Teseq, which previously had acquired Milmega and Instruments for Industry (IFI).