EDN

Applied drives CMP process control down to 45 nm and smaller

To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...
EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
Semiconductor Engineering

Precise Control Needed For Copper Plating And CMP

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
Semiconductor Engineering

Creating An Accurate FEOL CMP Model

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...
Yahoo Finance

Chemical Mechanical Planarization Slurry Market Size Worth $2.7 Billion by 2030 - Manufacturers' Growing Investments in Semiconductor Wafer Fabrication Materials

Newark, Dec. 08, 2022 (GLOBE NEWSWIRE) -- As per the report published by The Brainy Insights, the global Chemical Mechanical Planarization (CMP) slurry market is expected to grow from USD 1.5 billion ...
AZOM

Using White Light Interferometry to Characterize CMP Processes

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...