India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin ...

India announces its first 3D semiconductor packaging unit in Odisha, boosting AI, 5G and defence manufacturing ambitions!

Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom ...

Lam Research Corporation LRCX sees advanced packaging as a major growth driver for its Systems segment sales in fiscal 2026. The company crossed $1 billion in advanced packaging-related revenues in ...

With two out of ten approved semiconductor projects nationwide located in the state, Odisha is positioning itself as a ...

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...

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India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...

The foundation stone for India’s first advanced 3D chip packaging unit was laid at Info Valley in the Khordha district in ...