Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

Fabrication of 3D NAND devices involves a challenging and complex deposition and etch process. Two etch processes have been identified as substantially impacting 3D NAND product yields: silicon ...

The rapid migration to mobile electronics, and the growing richness of applications like data streaming and social media, is raising new performance imperatives for memory capacity and speed. The ...

It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions kick off in ...

For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...

China's Yangtze Memory Technologies (YMTC) continues to suffer from low yield rates for 128-layer 3D NAND flash manufacturing, which are estimated at only 30-40%, according to market sources. YMTC ...

Traditional 2D NAND-based flash memory has been a workhorse of our digital storage economy, but its architecture has reached its physical limits, so suppliers are moving on to the next generation: 3D ...